ASTM F72-24

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ASTM F72-24

2024

Most Recent

Standard Specification for Gold Wire for Semiconductor Lead Bonding

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1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.

Note 1: Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as "modifying," "stabilizing," or "doping." The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, "high-strength" and "special purpose" wire, the identity of modifying additives is not restricted.
1.2 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.
1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
ASTM F72-24
STANDARD INFO:
Standard NameASTM F72-24
ScopeStandard Specification for Gold Wire for Semiconductor Lead Bonding
PublisherASTM - ASTM International
LanguagesEnglish
State
Publication Year2024
Most recent VersionMOST RECENT
Whether to be replaced
Addendum
FILE INFO:
File Size1 file , 630 KB
NoteThis product is unavailable in Russia, Ukraine, Belarus
Number of Pages11
Published04/01/2024
This document does not provide a preview.
ASTM F72-24
HistoryPublisher Year
ASTM F72-242024Current
ASTM F72-212024
ASTM F72-17e12017
ASTM F72-172017
ASTM F72-062006
ASTM F72-95(2001)2001
ASTM F72-951995

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