$22
CEI EN 62047-17
2016
Semiconductor devices – Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin films
- Format:
- Language(s) :
- Published :
- English
- 01/01/2016
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μm to 10 μm, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm.
The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window.
Elastic modulus and residual stress for the film materials can be determined with this method.
| CEI EN 62047-17 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 62047-17 |
| Scope | Semiconductor devices - Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin films |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2016 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 16 |
| File Size | 1 file , 880 KB |
| Number of Pages | 34 |
| Published | 01/01/2016 |
| CEI EN 62047-17 | ||
|---|---|---|
| History | Publisher Year | |
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