$57
CEI CLC/TR 62258-3
2007
Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage
- Format:
- Language(s) :
- Published :
- English
- 03/01/2007
Questo TR (Technical Report) è un documento di supporto alle attività di produzione, fornitura ed uso dei prodotti a semiconduttore, inclusi:
– Wafers
– piastrine nude singole
– piastrine e wafers con strutture di connessione
– piastrine e wafers incapsulati in modo limitato o parziale
Il Report contiene suggerimenti di buona pratica per la gestione, la manipolazione, l’imballo/confezionamento e l’immagazzinamento dei prodotti a semiconduttore.
La cura e l’attenzione agli aspetti relativi alla gestione, alla manipolazione, all’imballo/confezionamento e all’immagazzinamento migliorano la produzione degli assiemi elettronici contenenti prodotti a semiconduttore.
Nel documento vi sono linee guida ricavate da esperienze del mondo industriale e risulta particolarmente utile nel caso di prima esperienza di integrazione di semiconduttori in assiemi.
Risulta altresì utile per approntare e controllare sistemi che trattino o utilizzino prodotti a semiconduttore, dalla produzione dei wafer all’assemblaggio finale.
Questa Norma viene pubblicata dal CEI nella sola lingua inglese in quanto particolarmente mirata a settori specialistici.
| CEI CLC/TR 62258-3 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI CLC/TR 62258-3 |
| Scope | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2007 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 1 |
| File Size | 1 file , 760 KB |
| Number of Pages | 52 |
| Published | 03/01/2007 |
| CEI CLC/TR 62258-3 | ||
|---|---|---|
| History | Publisher Year | |
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