$84
CEI EN 60191-4
2015
Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- Format:
- Language(s) :
- Published :
- English
- 04/01/2015
This part of IEC 60191 specifies a method for the designation of
package outlines and for the classification of forms of package
outlines for semiconductor devices and a systematic method for
generating universal descriptive designators for semiconductor
device packages.
The descriptive designator provides a useful communication tool
but has no implied control for assuring package
interchangeability.
| CEI EN 60191-4 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 60191-4 |
| Scope | Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2015 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 15 |
| File Size | 1 file , 330 KB |
| Number of Pages | 30 |
| Published | 04/01/2015 |
| CEI EN 60191-4 | ||
|---|---|---|
| History | Publisher Year | |
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