$38
CEI EN 60352-1
1998
Solderless connections – Part 1: Wrapped connections – General requirements, test methods and practical guidance
- Format:
- Language(s) :
- Published :
- English
- 12/01/1998
La presente Norma si applica a connessioni avvolte senza saldatura realizzate con fili singoli, rotondi e massicci, del diametro nominale minimo di 0,16 mm e con piedini progettati appositamente per usi in apparecchiature per telecomunicazioni e in dispositivi elettronici che utilizzino tecniche similari. Essa contiene le prescrizioni volte a stabilire l'idoneità delle connessioni avvolte senza saldatura in condizioni specificate di prova.
La presente EN viene pubblicata dal CEI nella sola lingua originale inglese, a causa della limitata utilizzazione, particolarmente mirata a settori specialistici.
| CEI EN 60352-1 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 60352-1 |
| Scope | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 1998 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 98 |
| File Size | 1 file , 470 KB |
| Number of Pages | 40 |
| Published | 12/01/1998 |
| CEI EN 60352-1 | ||
|---|---|---|
| History | Publisher Year | |
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