$22
CEI EN 61189-5-4
2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- Format:
- Language(s) :
- Published :
- English
- 05/01/2016
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.
| CEI EN 61189-5-4 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 61189-5-4 |
| Scope | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2016 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 16 |
| File Size | 1 file , 1.9 MB |
| Number of Pages | 32 |
| Published | 05/01/2016 |
| CEI EN 61189-5-4 | ||
|---|---|---|
| History | Publisher Year | |
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