$23
CEI EN IEC 61249-2-51
2023
Materials for printed boards and other interconnecting structures Part 2-51: Reinforced base materials, clad and unclad – Base materials for integrated circuit card carrier tape, unclad
- Format:
- Language(s) :
- Published :
- English
- 10/01/2023
ENGLISH
This part of IEC 61249 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
| CEI EN IEC 61249-2-51 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN IEC 61249-2-51 |
| Scope | Materials for printed boards and other interconnecting structures Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2023 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 23# |
| File Size | 1 file , 1.8 MB |
| Number of Pages | 26 |
| Published | 10/01/2023 |
| CEI EN IEC 61249-2-51 | ||
|---|---|---|
| History | Publisher Year | |
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