$21
CEI EN 60317-35
2014
Specifications for particular types of winding wires Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
- Format:
- Language(s) :
- Published :
- English,Italian
- 06/01/2014
BILINGUAL
This part of IEC 60317 specifies the requirements of solderable
enamelled round copper winding wire of class 155 with a dual
coating. The underlying coating is based on polyurethane resin,
which may be modified providing it retains the chemical identity of
the original resin and meets all specified wire requirements. The
superimposed coating is a bonding layer based on a thermoplastic
resin.
NOTE A modified resin is a resin that has undergone a chemical
change, or contains one or more additives to enhance certain
performance or application characteristics.
The range of nominal conductor diameters covered by this
standard is:
— Grade 1B: 0,020 mm up to and including 0,800 mm;
— Grade 2B: 0,020 mm up to and including 0,800 mm.
The nominal conductor diameters are specified in Clause 4 of IEC
60317-0-1:2013.
| CEI EN 60317-35 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 60317-35 |
| Scope | Specifications for particular types of winding wires Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English,Italian |
| State | [ Active ] |
| Publication Year | 2014 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 14# |
| File Size | 1 file , 210 KB |
| Number of Pages | 26 |
| Published | 06/01/2014 |
| CEI EN 60317-35 | ||
|---|---|---|
| History | Publisher Year | |
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