$19
CEI EN 60749-3
2017
Semiconductor devices – Mechanical and climatic test methods Part 3: External visual examination
- Format:
- Language(s) :
- Published :
- English
- 10/01/2017
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
| CEI EN 60749-3 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 60749-3 |
| Scope | Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2017 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 17 |
| File Size | 1 file , 740 KB |
| Number of Pages | 20 |
| Published | 10/01/2017 |
| CEI EN 60749-3 | ||
|---|---|---|
| History | Publisher Year | |
| CEI EN 60749-3 | 2017 | Current |
| CEI EN 60749-3 | 2004 |
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