CEI EN IEC 60749-28

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CEI EN IEC 60749-28

2022

Most Recent

Semiconductor devices – Mechanical and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM) – device level

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This part of IEC 60749 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J.

The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.

CEI EN IEC 60749-28
STANDARD INFO:
Standard NameCEI EN IEC 60749-28
ScopeSemiconductor devices - Mechanical and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
PublisherCEI - Comitato Elettrotecnico Italiano
LanguagesEnglish
State[ Active ]
Publication Year2022
Most recent VersionMOST RECENT
Whether to be replaced
Addendum
FILE INFO:
Edition22#
File Size1 file , 4.5 MB
Number of Pages56
Published11/01/2022
This document does not provide a preview.
CEI EN IEC 60749-28
HistoryPublisher Year
CEI EN IEC 60749-282022Current
CEI EN 60749-282017

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