$50
IPC J-STD-027
2003
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
- Format:
- Language(s) :
- Published :
- English
- 02/01/2003
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
| IPC J-STD-027 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC J-STD-027 |
| Scope | Mechanical Outline Standard for Flip Chip or Chip Scale Configurations |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 2003 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 90 KB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 20 |
| Product Code(s) | J-027(D)1, J-027(D)1 |
| Published | 02/01/2003 |
| IPC J-STD-027 | ||
|---|---|---|
| History | Publisher Year | |
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