$67
IPC 6801
2000
Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
- Format:
- Language(s) :
- Published :
- English
- 01/01/2000
Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs.
| IPC 6801 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 6801 |
| Scope | Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 2000 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 1st |
| File Size | 1 file , 430 KB |
| ISBN(s) | 1580982395 |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 41 |
| Published | 01/01/2000 |
| IPC 6801 | ||
|---|---|---|
| History | Publisher Year | |
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