$91
IPC JEDEC-9704A
2012
Printed Circuit Assembly Strain Gage Test Guideline
- Format:
- Language(s) :
- Published :
- English,Chinese
- 02/01/2012
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. This document also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement and has been updated to address lead-free assembly technology
| IPC JEDEC-9704A | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC JEDEC-9704A |
| Scope | Printed Circuit Assembly Strain Gage Test Guideline |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English,Chinese |
| State | |
| Publication Year | 2012 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 2.1 MB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 32 |
| Published | 02/01/2012 |
| IPC JEDEC-9704A | ||
|---|---|---|
| History | Publisher Year | |
| IPC JEDEC-9704A | 2012 | Current |
| IPC 9704 | 2005 |
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