IPC 1602

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IPC 1602

2020

Most Recent

Standard for Printed Board Handling and Storage

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The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.

IPC 1602
STANDARD INFO:
Standard NameIPC 1602
ScopeStandard for Printed Board Handling and Storage
PublisherIPC - Association Connecting Electronics Industries
LanguagesEnglish,Chinese,Japanese
State
Publication Year2020
Most recent VersionMOST RECENT
Whether to be replaced
Addendum
FILE INFO:
File Size1 file , 870 KB
ISBN(s)9781951577193
NoteThis product is unavailable in Russia, Ukraine, Belarus
Number of Pages36
Product Code(s)1602-STD-0-D-0-EN-0, 1602-STD-0-D-0-CN-0, 1602-STD-0-D-0-JP-0 , 1602-STD-0-D-0-EN-0, 1602-STD-0-D-0-CN-0, 1602-STD-0-D-0-JP-0
Published04/07/2020
This document does not provide a preview.
IPC 1602
HistoryPublisher Year

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