$91
IPC 6013E
2021
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
- Format:
- Language(s) :
- Published :
- English,Chinese
- 09/01/2021
This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
| IPC 6013E | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 6013E |
| Scope | Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English,Chinese |
| State | |
| Publication Year | 2021 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 2.7 MB |
| ISBN(s) | 9781638160205 |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 84 |
| Product Code(s) | 6013-STD-0-D-0-EN-E, 6013-STD-0-D-0-CN-E, 6013-STD-0-D-0-EN-E, 6013-STD-0-D-0-CN-E |
| Published | 09/01/2021 |
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