IPC 7095E

$91

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IPC 7095E

2024

Most Recent

Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

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This document describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, rework and reliability issues associated with design and assembly of printed boards using these packages.

IPC 7095E
STANDARD INFO:
Standard NameIPC 7095E
ScopeDesign and Assembly Process Guidance for Ball Grid Arrays (BGAs)
PublisherIPC - Association Connecting Electronics Industries
LanguagesEnglish
State
Publication Year2024
Most recent VersionMOST RECENT
Whether to be replaced
Addendum
FILE INFO:
File Size1 file , 17 MB
ISBN(s)9781638161790
NoteThis product is unavailable in Russia, Ukraine, Belarus
Number of Pages208
Product Code(s)7095-STD-0-D-0-EN-E, 7095-STD-0-D-0-EN-E
Published08/01/2024
IPC 7095E
HistoryPublisher Year
IPC 7095E2024Current
IPC 7095D-WAM12019
IPC 7095D2018
IPC 7095C2013
IPC 7095B2008
IPC 7095A2005

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