$50
IPC 3408
1996
General Requirements for Anisotropically Conductive Adhesives Films
- Format:
- Language(s) :
- Published :
- English
- 11/01/1996
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
| IPC 3408 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 3408 |
| Scope | General Requirements for Anisotropically Conductive Adhesives Films |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 1996 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 480 KB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 32 |
| Product Code(s) | 3408(D)1 |
| Published | 11/01/1996 |
| IPC 3408 | ||
|---|---|---|
| History | Publisher Year | |
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