$34
AIA NAS4121
2020
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
- Format:
- Language(s) :
- Published :
- English
- 08/28/2020
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
| AIA NAS4121 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | AIA NAS4121 |
| Scope | HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED |
| Publisher | AIA - Aerospace Industries Association |
| Languages | English |
| State | [ Stabilized ] |
| Publication Year | 2020 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 260 KB |
| Number of Pages | 18 |
| Published | 08/28/2020 |
| Revision | 1 |
| AIA NAS4121 | ||
|---|---|---|
| History | Publisher Year | |
| AIA NAS4121 | 2020 | Current |
| AIA NAS4121 | 2012 | |
| AIA NAS4121 | 2012 | |
| AIA NAS4121 | 1996 |
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