$25
ASTM F1211-89(2001)
2001
Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)
- Format:
- Language(s) :
- Published :
- English
- 01/01/2001
1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.
1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.
1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
| ASTM F1211-89(2001) | |
|---|---|
| STANDARD INFO: | |
| Standard Name | ASTM F1211-89(2001) |
| Scope | Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007) |
| Publisher | ASTM - ASTM International |
| Languages | English |
| State | [ Withdrawn ] |
| Publication Year | 2001 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 29 KB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 3 |
| Published | 01/01/2001 |
| ASTM F1211-89(2001) | ||
|---|---|---|
| History | Publisher Year | |
| ASTM F1211-89(2001) | 2007 | Current |
| ASTM F1211-89(1994)e1 | 1994 |
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