$28
CEI EN 60191-6-3
2001
Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
- Format:
- Language(s) :
- Published :
- English
- 05/01/2001
Norma recepita mediante l'annuncio su CEINFORMA maggio 2001.
| CEI EN 60191-6-3 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 60191-6-3 |
| Scope | Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2001 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 01 |
| File Size | 1 file , 200 KB |
| Number of Pages | 24 |
| Published | 05/01/2001 |
| CEI EN 60191-6-3 | ||
|---|---|---|
| History | Publisher Year | |
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