CEI EN 60749-14
2004
Semiconductor devices – Mechanical and climatic test methods – Part 14: Robustness of terminations (lead integrity)
- Format:
- Language(s) :
- Published :
- English
- 11/01/2004
La presente Norma internazionale fa parte della serie IEC 60749 e descrive diversi metodi di prova per determinare l’integrità tra la terminazione e la struttura di supporto, quando le terminazioni stesse vengono piegate a causa assemblaggio difettoso di schede a seguito di rilavorazione del componente per riassemblaggio.
Nella norma vengono considerate le seguenti prove:
– Tensione/trazione
– Piegatura
– Affaticamento
– Torsione
Per le confezioni a tenuta, si raccomanda, dopo questa prova, di eseguire anche la prova di ermeticità ( secondo la IEC 60749-8) per verificare se anche gli involucri protettivi sono stati danneggiati.
Questo tipo di prova è da considerarsi di tipo distruttivo.
La Norma riguarda i dispositivi con montaggio a fori passanti ed a montaggio superficiale.
La presente Norma viene pubblicata dal CEI nella sola lingua originale inglese, a causa della limitata utilizzazione, particolarmente mirata a settori specialistici.
La presente Norma recepisce il testo originale inglese della Pubblicazione IEC e pertanto consta delle sole pagine dispari.
La presente Norma sostituisce in parte la CEI EN 60749:2000-10 (CEI 47-12)
fasc. 5845E.
CEI EN 60749-14 | |
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STANDARD INFO: | |
Standard Name | CEI EN 60749-14 |
Scope | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
Publisher | CEI - Comitato Elettrotecnico Italiano |
Languages | English |
State | [ Active ] |
Publication Year | 2004 |
Most recent Version | MOST RECENT |
Whether to be replaced | |
Addendum | |
FILE INFO: | |
Edition | 1 |
File Size | 1 file , 410 KB |
Number of Pages | 22 |
Published | 11/01/2004 |
CEI EN 60749-14 | ||
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History | Publisher Year | |
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