$30
CEI EN 61189-11
2014
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- Format:
- Language(s) :
- Published :
- English
- 02/01/2014
This part of IEC 61189 describes the measurement method of
melting ranges of solder alloys that are mainly used for wiring of
electrical equipment, for electrical and communication equipment,
and for other apparatus, as well as for connecting components
| CEI EN 61189-11 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 61189-11 |
| Scope | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2014 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 14 |
| File Size | 1 file , 2.4 MB |
| Number of Pages | 22 |
| Published | 02/01/2014 |
| CEI EN 61189-11 | ||
|---|---|---|
| History | Publisher Year | |
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