$55
CEI EN 61192-3
2003
Workmanship requirements for soldered electronic assemblies – Part 3: Through-hole mount assemblies
- Format:
- Language(s) :
- Published :
- English
- 08/01/2003
BILINGUAL * W/D S/S BY CEI 309
La presente Norma fa parte della serie IEC 61192 e definisce in dettaglio i requisiti generali e gli aspetti pratici relativi alla lavorazione degli assiemi saldati con montaggio a fori passanti, su substrati organici, su piastre stampate e su laminati simili, saldati sulla superficie di substrati inorganici.
La Norma riguarda assiemi realizzati parzialmente o completamente a fori passanti, includendo lavorazioni a montaggio superficiale o altre tecniche quali terminali, filamenti,ecc.
Fornitori ed utilizzatori di assiemi saldati a fori passanti possono usare la presente Norma per la stesura delle specifiche dei processi di fabbricazione con alti requisiti di qualità in fase di preparazione del contratto.
La presente Norma particolare è da usarsi congiuntamente alla Parte generale EN 61192-1 che riporta le definizioni basilari e le linee guida.
| CEI EN 61192-3 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 61192-3 |
| Scope | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Withdrawn ] |
| Publication Year | 2003 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 1 |
| File Size | 1 file , 3.3 MB |
| Number of Pages | 50 |
| Published | 08/01/2003 |
| CEI EN 61192-3 | ||
|---|---|---|
| History | Publisher Year | |
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