$34
CEI EN 62047-14
2013
Semiconductor devices – Micro-electromechanical devices Part 14: Forming limit measuring method of metallic film materials
- Format:
- Language(s) :
- Published :
- English
- 04/01/2013
This part of IEC 62047 describes definitions and procedures for
measuring the forming limit of metallic film materials with a
thickness range from 0,5 μm to 300 μm. The metallic film materials
described herein are typically used in electric components, MEMS
and microdevices.
When metallic film materials used in MEMS (see 2.1.2 of IEC
62047-1:2005) are fabricated by a forming process such as
imprinting, it is necessary to predict the material failure in
order to increase the reliability of the components. Through this
prediction, the effectiveness of manufacturing MEMS components by a
forming process can also be improved, because the period of
developing a product can be reduced and manufacturing costs can
thus be decreased. This standard presents one of the prediction
methods for material failure in imprinting process.
| CEI EN 62047-14 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 62047-14 |
| Scope | Semiconductor devices - Micro-electromechanical devices Part 14: Forming limit measuring method of metallic film materials |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2013 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 13 |
| File Size | 1 file , 1.1 MB |
| Number of Pages | 24 |
| Published | 04/01/2013 |
| CEI EN 62047-14 | ||
|---|---|---|
| History | Publisher Year | |
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