$11
CEI EN 62047-15
2016
Semiconductor devices – Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
- Format:
- Language(s) :
- Published :
- English
- 01/01/2016
ITALIAN
| CEI EN 62047-15 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 62047-15 |
| Scope | Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2016 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 16 |
| File Size | 2 files , 580 KB |
| Number of Pages | 22 |
| Published | 01/01/2016 |
| CEI EN 62047-15 | ||
|---|---|---|
| History | Publisher Year | |
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