$38
CEI EN 62047-8
2012
Semiconductor devices – Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films
- Format:
- Language(s) :
- Published :
- English
- 05/01/2012
SAME AS IEC 62047-8
This international standard specifies the strip bending test
method to measure tensile properties of thin films with high
accuracy, repeatability, moderate effort of alignment and handling
compared to the conventional tensile test. This testing method is
valid for test pieces with a thickness between 50 nm and several
mm, and with an aspect ratio (ratio of length to thickness) of more
than 300.
The hanging strip (or bridge) between two fixed supports are
widely adopted in MEMS or micro-machines. It is much easier to
fabricate these strips than the conventional tensile test pieces.
The test procedures are so simple to be readily automated. This
international standard can be utilized as a quality control test
for MEMS production since its testing throughput is very high
compared to the conventional tensile test.
| CEI EN 62047-8 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN 62047-8 |
| Scope | Semiconductor devices - Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2012 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 12 |
| File Size | 1 file , 1.2 MB |
| Number of Pages | 24 |
| Published | 05/01/2012 |
| CEI EN 62047-8 | ||
|---|---|---|
| History | Publisher Year | |
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