CEI EN 62137-3

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CEI EN 62137-3

2012

Most Recent

Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints

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BILINGUAL

This part of IEC 62137 describes the selection methodology of an
appropriate test method for a reliability test for solder joints of
various shapes and types of surface mount devices (SMD), array type
devices and leaded devices, and lead insertion type devices using
various types of solder material alloys.

CEI EN 62137-3
STANDARD INFO:
Standard NameCEI EN 62137-3
ScopeElectronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints
PublisherCEI - Comitato Elettrotecnico Italiano
LanguagesEnglish
State[ Active ]
Publication Year2012
Most recent VersionMOST RECENT
Whether to be replaced
Addendum
FILE INFO:
Edition12
File Size1 file , 1 MB
Number of Pages90
Published08/01/2012
This document does not provide a preview.
CEI EN 62137-3
HistoryPublisher Year

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