CEI EN 62418

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CEI EN 62418

2011

Most Recent

Semiconductor devices – Metallization stress void test

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Questa Norma descrive un metodo di prova per le cavità (vuoti) dovuti alle sollecitazioni che si generano durante la metallizzazione.
Essa è adatta per valutazioni di affidabilità e certificazione dei processi per semiconduttori ed è applicabile per metallizzazioni con alluminio o con rame.
Due sono i metodi presentati:
– Metodo di misura della resistenza.
– Metodo di ispezione.
Negli allegati sono descritti:
– I meccanismi di migrazione degli stress.
– I fattori inerenti la tecnologia per l’alluminio e per il rame.
– Le precauzioni da tener presenti.
Questa Norma viene pubblicata dal CEI nella sola lingua inglese in quanto particolarmente mirata a settori specialistici.
La presente Norma recepisce il testo originale inglese della Pubblicazione IEC.

CEI EN 62418
STANDARD INFO:
Standard NameCEI EN 62418
ScopeSemiconductor devices - Metallization stress void test
PublisherCEI - Comitato Elettrotecnico Italiano
LanguagesEnglish
State[ Active ]
Publication Year2011
Most recent VersionMOST RECENT
Whether to be replaced
Addendum
FILE INFO:
Edition11
File Size1 file , 810 KB
Number of Pages22
Published10/01/2011
This document does not provide a preview.
CEI EN 62418
HistoryPublisher Year

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