$56
CEI EN IEC 60286-3
2023
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
- Format:
- Language(s) :
- Published :
- English
- 04/01/2023
ENGLISH
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
| CEI EN IEC 60286-3 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN IEC 60286-3 |
| Scope | Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2023 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 23# |
| File Size | 1 file , 3.8 MB |
| Number of Pages | 64 |
| Published | 04/01/2023 |
| CEI EN IEC 60286-3 | ||
|---|---|---|
| History | Publisher Year | |
| CEI EN IEC 60286-3 | 2023 | Current |
| CEI EN IEC 60286-3 | 2019 | |
| CEI EN 60286-3 | 2014 |
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