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CEI EN IEC 60749-10
2022
Semiconductor devices – Mechanical and climatic test methods Part 10: Mechanical shock – Device and subassembly
- Format:
- Language(s) :
- Published :
- English
- 12/01/2022
ENGLISH
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
| CEI EN IEC 60749-10 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN IEC 60749-10 |
| Scope | Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2022 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 22# |
| File Size | 1 file , 2.1 MB |
| Number of Pages | 20 |
| Published | 12/01/2022 |
| CEI EN IEC 60749-10 | ||
|---|---|---|
| History | Publisher Year | |
| CEI EN IEC 60749-10 | 2022 | Current |
| CEI EN 60749-10 | 2004 |
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