$32
CEI EN IEC 61188-6-2
2021
Circuit boards and circuit board assemblies – Design and use Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)
- Format:
- Language(s) :
- Published :
- English
- 11/01/2021
ENGLISH
This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
| CEI EN IEC 61188-6-2 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN IEC 61188-6-2 |
| Scope | Circuit boards and circuit board assemblies - Design and use Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2021 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 21 |
| File Size | 1 file , 2.9 MB |
| Number of Pages | 34 |
| Published | 11/01/2021 |
| CEI EN IEC 61188-6-2 | ||
|---|---|---|
| History | Publisher Year | |
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