$16
CEI EN IEC 61189-2-804
2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300
- Format:
- Language(s) :
- Published :
- English
- 01/01/2024
ENGLISH
This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
| CEI EN IEC 61189-2-804 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN IEC 61189-2-804 |
| Scope | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2024 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 24# |
| File Size | 1 file , 1.5 MB |
| Number of Pages | 18 |
| Published | 01/01/2024 |
| CEI EN IEC 61189-2-804 | ||
|---|---|---|
| History | Publisher Year | |
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