$48
CEI EN IEC 61760-1
2021
Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs)
- Format:
- Language(s) :
- Published :
- English
- 05/01/2021
ENGLISH
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
| CEI EN IEC 61760-1 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | CEI EN IEC 61760-1 |
| Scope | Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) |
| Publisher | CEI - Comitato Elettrotecnico Italiano |
| Languages | English |
| State | [ Active ] |
| Publication Year | 2021 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| Edition | 21 |
| File Size | 1 file , 3.3 MB |
| Number of Pages | 52 |
| Published | 05/01/2021 |
| CEI EN IEC 61760-1 | ||
|---|---|---|
| History | Publisher Year | |
| CEI EN IEC 61760-1 | 2021 | Current |
| CEI EN 61760-1 | 2007 |
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