CEI EN IEC 61760-2
2022
Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
- Format:
- Language(s) :
- Published :
- English
- 05/01/2022
ENGLISH
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
CEI EN IEC 61760-2 | |
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STANDARD INFO: | |
Standard Name | CEI EN IEC 61760-2 |
Scope | Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
Publisher | CEI - Comitato Elettrotecnico Italiano |
Languages | English |
State | [ Active ] |
Publication Year | 2022 |
Most recent Version | MOST RECENT |
Whether to be replaced | |
Addendum | |
FILE INFO: | |
Edition | 22# |
File Size | 1 file , 2.4 MB |
Number of Pages | 24 |
Published | 05/01/2022 |
CEI EN IEC 61760-2 | ||
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History | Publisher Year | |
CEI EN IEC 61760-2 | 2022 | Current |
CEI EN 61760-2 | 2008 |
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