$68
DIN EN 60191-4
2019
Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
- Format:
- Language(s) :
- Published :
- German
- 02/01/2019
Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
| DIN EN 60191-4 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | DIN EN 60191-4 |
| Scope | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 |
| Publisher | DIN - DIN-adopted European Standard |
| Languages | German |
| State | |
| Publication Year | 2019 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 39 |
| Product Code(s) | 3007019, 3007019 |
| Published | 02/01/2019 |
| DIN EN 60191-4 | ||
|---|---|---|
| History | Publisher Year | |
| DIN EN 60191-4 | 2013 | Current |
| DIN EN 60191-4/A1 - DRAFT | 2016 | |
| DIN EN 60191-4 | 2013 | |
| DIN EN 60191-4 | 2001 |
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