$48
DIN EN 60191-6-4
2004
Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
- Format:
- Language(s) :
- Published :
- German
- 01/01/2004
Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
| DIN EN 60191-6-4 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | DIN EN 60191-6-4 |
| Scope | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003 |
| Publisher | DIN - DIN-adopted European Standard |
| Languages | German |
| State | |
| Publication Year | 2004 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 20 |
| Product Code(s) | 9524259, 9524259 |
| Published | 01/01/2004 |
| DIN EN 60191-6-4 | ||
|---|---|---|
| History | Publisher Year | |
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