$37
DIN IEC 62047-13 – DRAFT
2010
Draft Document – Semiconductor devices – Micro electro mechanical devices – Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
- Format:
- Language(s) :
- Published :
- German, English
- 05/01/2010
Draft Document – Semiconductor devices – Micro electro mechanical devices – Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
| DIN IEC 62047-13 – DRAFT | |
|---|---|
| STANDARD INFO: | |
| Standard Name | DIN IEC 62047-13 – DRAFT |
| Scope | Draft Document - Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010) |
| Publisher | DIN - DIN-adopted IEC Standard |
| Languages | German, English |
| State | |
| Publication Year | 2010 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file |
| Number of Pages | 20 |
| Product Code(s) | 1671668, 1671668 |
| Published | 05/01/2010 |
| DIN IEC 62047-13 – DRAFT | ||
|---|---|---|
| History | Publisher Year | |
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