$86
IPC 0040
2003
Optoelectronics Assembly and Packaging Technology
- Format:
- Language(s) :
- Published :
- English
- 05/01/2003
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner in which these parts will become an integral part of the functioning module, board or subassembly.
| IPC 0040 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 0040 |
| Scope | Optoelectronics Assembly and Packaging Technology |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 2003 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 2.5 MB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 161 |
| Product Code(s) | 0040(D)1 |
| Published | 05/01/2003 |
| IPC 0040 | ||
|---|---|---|
| History | Publisher Year | |
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