IPC 1602
2020
Standard for Printed Board Handling and Storage
- Format:
- Language(s) :
- Published :
- English,Chinese,Japanese
- 04/07/2020
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements.
IPC 1602 | |
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STANDARD INFO: | |
Standard Name | IPC 1602 |
Scope | Standard for Printed Board Handling and Storage |
Publisher | IPC - Association Connecting Electronics Industries |
Languages | English,Chinese,Japanese |
State | |
Publication Year | 2020 |
Most recent Version | MOST RECENT |
Whether to be replaced | |
Addendum | |
FILE INFO: | |
File Size | 1 file , 870 KB |
ISBN(s) | 9781951577193 |
Note | This product is unavailable in Russia, Ukraine, Belarus |
Number of Pages | 36 |
Product Code(s) | 1602-STD-0-D-0-EN-0, 1602-STD-0-D-0-CN-0, 1602-STD-0-D-0-JP-0 , 1602-STD-0-D-0-EN-0, 1602-STD-0-D-0-CN-0, 1602-STD-0-D-0-JP-0 |
Published | 04/07/2020 |
IPC 1602 | ||
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History | Publisher Year | |
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