$71
IPC 2225
1998
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
- Format:
- Language(s) :
- Published :
- English
- 05/01/1998
This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
| IPC 2225 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 2225 |
| Scope | Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies) |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 1998 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| ANSI | ANSI Approved |
| File Size | 1 file , 590 KB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 44 |
| Product Code(s) | 2225(D)1 |
| Published | 05/01/1998 |
| IPC 2225 | ||
|---|---|---|
| History | Publisher Year | |
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