$71
IPC 2315
2000
Design Guide for High Density Interconnects & Microvias
- Format:
- Language(s) :
- Published :
- English
- 06/01/2000
High density interconnect (HDI) and microvia technologies are the PWB industry's current manufacturing challenge. Published jointly with the Japan Printed Circuits Association, IPC-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. The document addresses various considerations when designing an HDI printed wiring board that include: design examples and processes, selection of materials, general descriptions, and various microvia technologies. This industry publication offers designers and manufacturers one source for reliable design and manufacturability information for
commonly produced HDI boards. It includes over 30 full color illustrations to assist the user. 33 pages. Released June 2000.
| IPC 2315 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 2315 |
| Scope | Design Guide for High Density Interconnects & Microvias |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 2000 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 560 KB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 40 |
| Product Code(s) | 2315(D)1, 2315(D)1 |
| Published | 06/01/2000 |
| IPC 2315 | ||
|---|---|---|
| History | Publisher Year | |
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