$74
IPC 4203B
2018
Cover and Bonding Material for Flexible Printed Circuitry
- Format:
- Language(s) :
- Published :
- English
- 03/01/2018
IPC 4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address nonflexible adhesives designed to be used in the rigid board areas of rigid flex constructions which are addressed in IPC-4101. Materials such as liquid-applied covercoat are delineated in IPC-SM-840 and are excluded from this document. The requirements herein meet or exceed the requirements for Class 3 which, in turn, meet or exceed conformance to Classes 1 and 2.
| IPC 4203B | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 4203B |
| Scope | Cover and Bonding Material for Flexible Printed Circuitry |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | [ Withdrawn ] |
| Publication Year | 2018 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 560 KB |
| Note | This product is unavailable in Russia, Belarus |
| Number of Pages | 52 |
| Product Code(s) | 4203-STD-0-D-0-EN-B |
| Published | 03/01/2018 |
| IPC 4203B | ||
|---|---|---|
| History | Publisher Year | |
| IPC 4203B | 2018 | Current |
| IPC 4203A | 2013 | |
| IPC 4203 | 2002 | |
| IPC FC-232C | 1992 |
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