$50
IPC 4563
2007
Resin Coated Copper Foil for Printed Boards Guideline
- Format:
- Language(s) :
- Published :
- English
- 11/01/2007
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
| IPC 4563 | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 4563 |
| Scope | Resin Coated Copper Foil for Printed Boards Guideline |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English |
| State | |
| Publication Year | 2007 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 270 KB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 19 |
| Published | 11/01/2007 |
| IPC 4563 | ||
|---|---|---|
| History | Publisher Year | |
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