$90
IPC 7091A
2023
Design and Assembly Process Implementation of 3D Components
- Format:
- Language(s) :
- Published :
- English,Japanese
- 01/01/2023
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.
| IPC 7091A | |
|---|---|
| STANDARD INFO: | |
| Standard Name | IPC 7091A |
| Scope | Design and Assembly Process Implementation of 3D Components |
| Publisher | IPC - Association Connecting Electronics Industries |
| Languages | English,Japanese |
| State | |
| Publication Year | 2023 |
| Most recent Version | MOST RECENT |
| Whether to be replaced | |
| Addendum | |
| FILE INFO: | |
| File Size | 1 file , 7.8 MB |
| ISBN(s) | 9781638161134 |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages | 104 |
| Product Code(s) | 7091-STD-0-D-0-JP-A, 7091-STD-0-P-0-JP-A |
| Published | 01/01/2023 |
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